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TS991SNL35T4
TS991SNL35T4Reference image

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Mfr. #:
TS991SNL35T4
Batch:
new
Description:
No-clean solder paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
Datasheet:
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Specifications
frequently asked question
Product AttributeAttribute Value
Manufacturer Chip Quik Inc.
Series CHIPQUIK?
Packaging Bulk
Type Solder Paste
Ingredients Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423°F (217°C)
Flux Type No Clean
Wire Gauge -
Mesh Type 4
Process -
Form Factor Syringe, 1.23 oz (34.869g)
Shelf Life 12 Months
Shelf Life Start Date Manufacturing Date
Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
Shipping Information -
Weight -
Other product information

Advantage price,TS991SNL35T4 in stock can be shipped on the same day

In Stock: 19
Qty.Unit PriceExt. Price
1+ $52.8291 $52.8291
5+ $48.4312 $242.156
10+ $41.8265 $418.265
25+ $37.4241 $935.6025
50+ $35.2226 $1761.13
100+ $33.0212 $3302.12
Enter Quantity:
Unit Price:
$0.47
Ext. Price:
$0.94
In Stock:
19
Minimum:
1
MPQ:
1
Multiples:
1
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